20–23 Oct 2020
VBLHEP, JINR, Dubna, RUSSIA
Europe/Moscow timezone

Bonding test procedure developed for the assembly of BM@N STS modules

23 Oct 2020, 15:20
20m
https://meet3.interprocom.ru/RFBR_NICA_room3

https://meet3.interprocom.ru/RFBR_NICA_room3

Speaker

Anatoly Kolozhvari (JINR)

Description

RFBR grant 18-02-40047
The Silicon Tracking System (STS) of BM@N experiment will be based on modules with double-sided microstrip silicon sensors, which have been developed for the CBM experiment at FAIR. Each module consists of a double-sided sensor, two front-end boards with 8 ASICs each and a set of low-mass aluminum microcables. During the module assembly microcables are Tab-bonded to the sensor and readout ASICs. Each module has 1024 channels on both sides. For the quality assurance of the bonding parameters a dedicated procedure based on the noise per channel measurements in a Pogo-Pin test circuit was developed.

Presentation materials